Training and deploying large-scale AI models require immense computing power and specialized hardware, all housed within high-performance data centers.
To meet these demands, organizations are increasingly investing in low-carbon energy sources, including nuclear and fusion technologies, to support the city-scale power consumption of these data centers.
Our specialty metal products play a critical role in ensuring the performance, safety, and reliability of these cutting-edge applications.
AI Data Centers
Data centers are the backbone of AI infrastructure, providing the computing power and energy storage needed to handle massive data loads and ensure uninterrupted performance. Our products support these critical facilities through:
Nuclear Energy
The nuclear energy sector is driving innovation beyond traditional power generation. This includes revitalizing ageing reactors, developing small modular reactors (SMRs) for scalable deployment, and advancing micro-reactors to meet the energy demands of AI data centers and next-generation defense applications. Our products include:
Fusion Energy
Fusion energy represents the next frontier in clean power, offering virtually limitless, carbon-free electricity to meet the growing demands of AI infrastructure. Applications for our products include:
Semiconductors
Semiconductors are critical in AI hardware, enabling the processing power required for advanced computing. Our specialized materials support both the manufacturing process and semiconductor packaging.
- Filter powders – Critical for flow control and filtration systems in semiconductor manufacturing. Used in wafer cleaning, chemical etching, photolithography, and cleanroom gas delivery systems to maintain purity and process integrity.
- Thermal Management Materials – Engineered for Gallium Nitride (GaN)-based semiconductors, these materials efficiently control and dissipate heat in high-performance environments such as data centers powering AI and cloud computing.
- Micro components – Solder Preforms for die attach in semiconductor packaging, Bonding Wire and Ribbon for IC interconnects ensuring high conductivity, and Bond Pads for wire bonding connectivity and structural integrity in microelectronics.
