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Key Advantages
- Superior thermal properties compared to other silicon carbide aluminum products.
- Thermal expansion is closely controlled to match the components used in electronic packages.
- Offered in both simple and complex fabricated shapes and in any variety of net shaped parts.
- Cost effective solutions to many thermal management problems.
- Manufacturing process does not require a separate preform to produce the composite product.
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| Available Types of Plating |
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| Electroless Nickel |
MIL-C-26074E
Class 1, 2, 3 or 4 |
| Electrolytic Nickel |
QQ-N-290A
Class 1 or 2 |
| Hard Gold |
MIL-G-54204C
Type 3 Grade A |
| Electrolytic Copper |
MIL-C-14550B
Class 1, 2, 3 or 4 |
| Tin |
MIL-T-10727C |
| Silver |
As specified |
Parts are typically bake tested at
temperatures up to 400°C |
Materials are available as finished parts with the following dimensions:
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Width: 6 inches (152 mm) maximum
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Length: 10 inches (254 mm) maximum
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Thickness: 0.015 inches (0.391 mm) minimum
| 68±2% VOLUME FRACTION ALPHA SILICON CARBIDE |
|
B |
C |
| DENSITY |
lb./in.3
Gm/cc |
0.110
3.04 |
0.109
3.03 |
THERMAL
EXPANSION |
30-150°C
(in/in x 10-6/°C) |
7.5 |
6.8 |
30-400°C
(in/in x 10-6/°C) |
8.7 |
7.6 |
THERMAL
CONDUCTIVITY |
W/MK
BTU/Hr.Ft.°F |
220
128 |
226
131 |
ELECTRICAL
CONDUCTIVITY |
%IACS |
5.8 |
5.4 |
TENSILE
STRENGTH |
KSI
MPa |
31
210 |
33
225 |
Mean Coefficient of Thermal Expansion (CTE) vs. Temperature
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