|
| |
|
-
Higher thermal conductivity than standard Molybdenum-Copper
-
Available in 1:3:1, 1:4:1, 1:5:1 and custom profiles
-
Full range of Mo-Cu compositions (70/30, 80/20, 85/15)
-
Adjustable coefficient of thermal expansion from 6 to 10 ppm/°K or beyond
-
100% IACS copper in clad layers
|
| |
|
|
|
