These composites of molybdenum-copper and tungsten-copper have many applications in electronic devices. The excellent thermal conductivity and low thermal expansion makes them ideal for:

• Chip mounting
• Heat Sinks
• Circuit Board Cores
• Lids or covers
• Thermal spreaders

The material can be machined into shapes and readily plated if required.

AMETEK’s wrought powder metallurgy composites have superior through-thickness thermal conductivity versus other products.