Composite Materials in Part Form for Thermal Management in Electronics
Available Models
Molybdenum-Copper Metal Matrix Composites (AMC Series) This series of composites, developed by AMETEK using its wrought powder metallurgy technology, has unique properties for use in:
- heat sinks
- substrates
- thermal spreaders
The material is available as finished parts with the following maximum dimensions depending on overall size:
Width: 0.050 - 5" (1.25 - 130 mm)
Thickness: 0.005" - 4" (0.125 - 102 mm)
Length: 0.050 - 21" (1.25 - 530 mm)
Tungsten-Copper Composites (AWC Series) These composites of molybdenum-copper and tungsten-copper have many applications in electronic devices. The excellent thermal conductivity and low thermal expansion makes them ideal for:
Chip mounting
Heat sinks
Circuit board cores
Lids or covers
Thermal spreaders
The material can be machined into shapes and readily plated if required.
Silicon Carbide Aluminum Metal Matrix Composites Al-SiC B and Al-SiC C are composite materials combining Silicon Carbide particles in an Aluminum alloy matrix. They provide low weight, high thermal conductivity, and controlled thermal expansion. The advantages of these high reliability materials allow designers to match expansion of other materials and provide a lightweight product in both simple and complex shapes. Al-SiC composites are cost effective solutions to many thermal management problems.
AMETEK can supply Al-SiC in either plated or unplated versions to customer specifications.
